CFD Analysis for Optimum Thermal Design of Carbon Nanotube Based Micro-Channel Heatsink

Farhad Ismail; A. I. Rashid; M. Mahbub

doi:10.4186/ej.2011.15.4.11

CFD Analysis for Optimum Thermal Design of Carbon Nanotube Based Micro-Channel Heatsink

Authors

Farhad Ismail Bangladesh University of Engineering and Technology
A. I. Rashid Bangladesh University of Engineering and Technology
M. Mahbub Bangladesh University of Engineering and Technology

DOI:

https://doi.org/10.4186/ej.2011.15.4.11

Keywords:

Carbon nanotube, micro-channel, CFD, cooling effects, thermal stress.

Abstract

Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packaging because of its extraordinary high thermal conductivity. Fabricated onto a silicon substrate to form micro-channels, the CNT based cooling fins show high heat dissipation efficiency. A series of 2D and 3D CFD simulations have been carried out for CNT based micro-channel cooling architectures based on one and two dimensional fin array in this paper using COMSOL 4.0a software. Micro-channels are generally regarded as an effective method for the heat transfer in electronic products. The influence of various fluids, micro-fin structures, fluid velocity and heating powers on cooling effects have been simulated and compared in this study. Steady-state thermal stress analyses for the forced convection heat transfer are also performed to determine maximum allowable stress and deflections for the different types of cooling assembly.

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Author Biographies

Farhad Ismail
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Department of Mechanical Engineering, Bangladesh University of Engineering and Technology, Bangladesh

A. I. Rashid
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Department of Mechanical Engineering, Bangladesh University of Engineering and Technology, Bangladesh

M. Mahbub
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Department of Mechanical Engineering, Bangladesh University of Engineering and Technology, Bangladesh

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Published In

Vol 15 No 4, Sep 3, 2011

How to Cite

[1]

F. Ismail, A. I. Rashid, and M. Mahbub, “CFD Analysis for Optimum Thermal Design of Carbon Nanotube Based Micro-Channel Heatsink”, Eng. J., vol. 15, no. 4, pp. 11-22, Sep. 2011.

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