Experimental Study of Copper Nano-fluid on Thermosyphons Thermal Performance

Authors

  • Jirapol Klinbun Rajamangala University of Technology Rattanakosin
  • Pradit Terdtoon Chiang Mai University

DOI:

https://doi.org/10.4186/ej.2017.21.1.255

Keywords:

Nano-fluid, thermosyphon, thermal performance, thermal resistance.

Abstract

A new way to remove the intense heat by developing and implementing an innovative low cost compact loop thermosyphon has been widely observed. Especially, it was concluded that nano-fluids are potential heat transfer fluids to be used as working fluid in thermosyphon. Therefore, the thermophysical or transport properties of nano-fluids in thermosyphon need to be discussed. In present work was to experimental study the thermal performance of thermosyphon using a copper nano-fluid as a working fluid. The experiment was performed in order to measure the temperature distribution and compare heat transfer rate of the thermosymphon with nano-fluid and with pure water. The concentration of copper nano-particle was 10, 30 and 50 ppm. The tested working temperature was 60, 70 and 80°C. Results shown that the concentration of 50 ppm of copper nano-fluid improved thermal performance compared with the case of pure water. The optimum and behavior of copper nano-fluid in thermosyphon is presented, which highlights all of the beforehand mentioned advantages.

Downloads

Download data is not yet available.

Author Biographies

Jirapol Klinbun
Google Scholar

Department of Mechanical Engineering, Faculty of Engineering, Rajamangala University of Technology Rattanakosin, 96 Moo 3, Phutthamonthon Sai 5 Road, Salaya, Phutthamonthon, Nakorn Prathom 73170, Thailand

Pradit Terdtoon
Google Scholar

Department of Mechanical Engineering, Faculty of Engineering, Chiang Mai University, 239 Huay Kaew Road, Muang District, Chiang Mai 50200, Thailand

Downloads

Published In
Vol 21 No 1, Jan 31, 2017
How to Cite
[1]
J. Klinbun and P. Terdtoon, “Experimental Study of Copper Nano-fluid on Thermosyphons Thermal Performance”, Eng. J., vol. 21, no. 1, pp. 255-264, Jan. 2017.
Cited By
Find in Google Scholar

Authors who publish with Engineering Journal agree to transfer all copyright rights in and to the above work to the Engineering Journal (EJ)'s Editorial Board so that EJ's Editorial Board shall have the right to publish the work for nonprofit use in any media or form. In return, authors retain: (1) all proprietary rights other than copyright; (2) re-use of all or part of the above paper in their other work; (3) right to reproduce or authorize others to reproduce the above paper for authors' personal use or for company use if the source and EJ's copyright notice is indicated, and if the reproduction is not made for the purpose of sale.